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surface mount discrete package

См. также в других словарях:

  • Surface-mount technology — (SMT) is a method for constructing electronic circuits in which the components (SMC, or Surface Mounted Components) are mounted directly onto the surface of printed circuit boards (PCBs). Electronic devices so made are called surface mount… …   Wikipedia

  • Discrete transistor — Discrete transistors are transistors that are individually packaged.The two main categories of packaging are through hole (or leaded ), and surface mount , also known as surface mount device (SMD).Transistor packages are made of glass, metal,… …   Wikipedia

  • Dual in-line package — PDIP redirects here. PDIP may also refer to Indonesian Democratic Party – Struggle. Three 14 pin (DIP14) plastic dual in line packages containing IC chips …   Wikipedia

  • Transistor — For other uses, see Transistor (disambiguation). Assorted discrete transistors. Packages in order from top to bottom: TO 3, TO 126, TO 92, SOT 23 A transistor is a semiconductor device used to amplify and switch electronic signals and power. It… …   Wikipedia

  • Integrated circuit — Silicon chip redirects here. For the electronics magazine, see Silicon Chip. Integrated circuit from an EPROM memory microchip showing the memory blocks, the supporting circuitry and the fine silver wires which connect the integrated circuit die… …   Wikipedia

  • Chip carrier — A standard sized 8 pin dual in line package (DIP) containing a 555 timer IC. A chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or… …   Wikipedia

  • Resistor — A typical axial lead resistor Type Passive Working principle Electrical resistance Invented Ge …   Wikipedia

  • Printed circuit board — Part of a 1983 Sinclair ZX Spectrum computer board; a populated PCB, showing the conductive traces, vias (the through hole paths to the other surface), and some mounted electrical components A printed circuit board, or PCB, is used to… …   Wikipedia

  • Ball grid array — For other uses, see BGA (disambiguation). Intel Embedded Pentium MMX (bottom view) A ball grid array (BGA) is a type of surface mount packaging used for integrated circuits. Contents …   Wikipedia

  • Operational amplifier — A Signetics μa741 operational amplifier, one of the most successful op amps. An operational amplifier ( op amp ) is a DC coupled high gain electronic voltage amplifier with a differential input and, usually, a single ended output.[1] An op amp… …   Wikipedia

  • Tecnología de montaje superficial — Varios dispositivos SMD. La tecnología de montaje superficial, más conocida por sus siglas en inglés SMT (Surface Mount Technology) es el método de construcción de dispositivos electrónicos más utilizado actualmente. Se usa tanto para componentes …   Wikipedia Español

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